TA YA’s NIC heading to Southeast Asia to expand the business of copper bonding wires

TA YA’s NIC heading to Southeast Asia to expand the business of copper bonding wires.

After SEMICONChina 2012 in March, TA YA’s New Business Development, Investment and Copper Management Business Group (NIC) headed to Singapore to attend SEMICON Singapore 2012 to put sealed copper bonding wire and palladiumelectroplated copper bonding wire on display, and search for qualified agents for the Asian market.

As gold prices continue to rise and copper packaging technology and experience matures, copper bonding wire is expected to show its potential. Copper is the core business of TA YA. The company successfully developed copper bonding wire to satisfy the IC packaging industry in 2003, expanding its territory from cable and wire to electronic materials. TA YA provides many leading companies with quality and stable products and receives great feedback.

The sealed copper bonding wire and palladiumelectroplated copper bonding wirewere strongly promoted by NIC and attracted many Southeast Asian customers and agents to inquire and ask for further discussion regarding cooperation.